TeYuan Wang 3d8c680f0a thermal: support more temperature and cooling device type ...

Bug: 312540064
Test: build
Change-Id: I6e11a181a09640e3f597344dbcbb7571b7e49453

2023-12-08 17:48:33 +00:00

..

build

Revert "compatibility_matrices: add vintf_compatibility_matrix.c..."

2023-11-17 19:24:01 +00:00

exclude

Add types-only AIDL package

2023-11-08 01:26:07 +00:00

Android.bp

Update Android V compatibility matrix

2023-11-30 18:14:38 -08:00

Android.mk

Remove compatibility_matrix.9.xml from 'next' builds

2023-11-09 21:39:32 +00:00

bump.py

compatibility_matrices: Add script to create the next.

2023-07-10 12:37:27 -07:00

CleanSpec.mk

Reland "Remove legacy/O/O-MR1 matrices."

2020-10-20 19:28:34 +00:00

clear_vars.mk

Allow OTA package to contain fake AVB version

2018-08-13 12:44:51 -07:00

compatibility_matrix.4.xml

Revert "Remove Q matrices"

2023-10-30 22:38:29 +00:00

compatibility_matrix.5.xml

Merge "FCM: add c2 software, IConfigurable instances" into main

2023-07-21 20:46:08 +00:00

compatibility_matrix.6.xml

Merge "FCM: add c2 software, IConfigurable instances" into main

2023-07-21 20:46:08 +00:00

compatibility_matrix.7.xml

compatibility_matrices: T launching devices allow to use light V1 AIDL.

2023-09-08 18:37:45 +00:00

compatibility_matrix.8.xml

Mark some HALs as updatable-via-apex retroactively

2023-11-09 21:39:15 +00:00

compatibility_matrix.9.xml

thermal: support more temperature and cooling device type

2023-12-08 17:48:33 +00:00

compatibility_matrix.empty.xml

Install all comp mat to system image

2018-01-10 19:17:23 -08:00

compatibility_matrix.mk

Build DEVICE_PRODUCT_COMPATIBILITY_MATRIX_FILE.

2019-01-25 13:58:34 -08:00

manifest.empty.xml

Build DEVICE_FRAMEWORK_COMPATIBILITY_MATRIX_FILE

2018-03-28 17:45:26 -07:00

OWNERS

Add OWNERS files to support dirs

2023-09-11 17:03:06 +00:00