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dt-bindings: interconnect: add interconnect bindings for Lemans

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Add interconnect device bindings. These devices can be used
to describe any RPMH and NoC based interconnect devices for lemans.

Change-Id: Iacc536aeaf9fdb977eb2a65cebfd56ff8167a13f
This commit is contained in:
Veera Vegivada
2021-08-23 15:37:42 +05:30
parent 7b8caf28f0
commit 35fcb4c316
1 changed files with 33 additions and 0 deletions
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bindings/interconnect/qcom,lemans.txt Normal file
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Qualcomm Technologies, Inc. Lemans Network-On-Chip interconnect driver binding
------------------------------------------------------------------------------
Lemans interconnect providers support system bandwidth requirements through
RPMh hardware accelerators known as Bus Clock Manager (BCM). The provider is
able to communicate with the BCM through the Resource State Coordinator (RSC)
associated with each execution environment. Provider nodes must point to at
least one RPMh device child node pertaining to their RSC and each provider
can map to multiple RPMh resources.
Required properties :
- compatible : shall contain only one of the following:
"qcom,lemans-aggre1_noc";
"qcom,lemans-aggre2_noc";
"qcom,lemans-clk_virt";
"qcom,lemans-config_noc";
"qcom,lemans-dc_noc";
"qcom,lemans-gem_noc";
"qcom,lemans-lpass_ag_noc";
"qcom,lemans-mc_virt";
"qcom,lemans-mmss_noc";
"qcom,lemans-nspa_noc";
"qcom,lemans-nspb_noc";
"qcom,lemans-system_noc";
"qcom,lemans-pcie_anoc";
"qcom,lemans-gpdsp_anoc";
- #interconnect-cells : should contain 1
Examples:
aggre1_noc: interconnect@16c0000 {
"qcom,lemans-aggre1_noc";
interconnect-cells = <1>;
};