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Merge "dt-bindings: thermal: Add dt-bindings"
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53
bindings/thermal/qcom,cx-ipeak-cdev.txt
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53
bindings/thermal/qcom,cx-ipeak-cdev.txt
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Qualcomm Technologies, Inc. CX Peak current cooling device
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The CX IPEAK cooling device, will be used to set thermal client vote to
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CX IPEAK LM hardware. When all pre-defined clients on CX rail including
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thermal client set their vote, CXIP LM hardware throttles pre-defined
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client on the same rail.
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Required Parameters:
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- compatible:
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Usage: required
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Value type: <string>
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Definition: should be "qcom,cxip-lm-cooling-device"
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- reg:
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Usage: required
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Value type: <values in hex>
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Definition: Must contain 2 variables <a b> where 'a' is the starting
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register address of the CX IPEAK LM hardware and 'b' is the
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size of the peripheral address space.
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- qcom,thermal-client-offset:
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Usage: Optional
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Value type: <value in hex>
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Definition: This property is required for CX IP LM v1.1 and above
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hardware. Must contain offset from CX IPEAK LM reg
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base for thermal client voting. If this property is not defined,
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then CX IPEAK cooling device will use legacy CXIP LM hardware
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offset registers.
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- qcom,bypass-client-list:
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Usage: Optional
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Value type: <value in hex>
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Definition: This property is required for CX IP LM v1.1 and above
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hardware. Must contain array of offsets from CX IPEAK LM reg
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base for clients those are not participating voting to CXIP LM
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hardware. This property makes sense only when thermal-client
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is defined.
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- #cooling-cells:
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Usage: required
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Value type: <integer>
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Definition: Must be 2. This is required by of-thermal and refer the doc
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<devicetree/bindings/thermal/thermal.txt> for more details.
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Example:
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cxip_cdev: cxip-cdev@1fed000 {
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compatible = "qcom,cxip-lm-cooling-device";
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reg = <0x1fed000 0x24>;
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qcom,thermal-client-offset = <0x8000>;
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qcom,bypass-client-list = <0x2004 0x3004>;
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#cooling-cells = <2>;
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};
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50
bindings/thermal/qti-cpu-isolation-cdev.txt
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50
bindings/thermal/qti-cpu-isolation-cdev.txt
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QTI CPU isolation cooling devices.
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The CPU isolation cooling device will be used for isolating a CPU on a thermal
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condition. This cooling device driver can register one cooling device per CPU,
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which can be used by thermal zone to mitigate.
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Each child node will represent a cooling device and the child node should
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point to the CPU, which will be mitigated by that cooling device instance.
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Properties:
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- compatible:
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Usage: required
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Value type: <string>
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Definition: should be "qcom,cpu-isolate"
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Cooling device node:
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- qcom,cpu:
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Usage: required
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Value type: <phandle>
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Definition: phandle to the CPU device that this cooling device will
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mitigate.
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-#cooling-cells:
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Usage: required
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Value type: <integer>
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Definition: Must be 2. Needed for of_thermal as cooling device
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identifier. Please refer to
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<devicetree/bindings/thermal/thermal.txt> for more
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details.
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Example:
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qcom,cpu-isolation {
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compatible = "qcom,cpu-isolate";
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cpu0_isolate: cpu0-isolate {
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qcom,cpu = <&CPU0>;
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#cooling-cells = <2>;
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};
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cpu1_isolate: cpu1-isolate {
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qcom,cpu = <&CPU1>;
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#cooling-cells = <2>;
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};
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cpu2_isolate: cpu2-isolate {
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qcom,cpu = <&CPU2>;
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#cooling-cells = <2>;
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};
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cpu3_isolate: cpu3-isolate {
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qcom,cpu = <&CPU3>;
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#cooling-cells = <2>;
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};
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};
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33
bindings/thermal/qti-lmh-cpu-vdd-cdev.txt
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33
bindings/thermal/qti-lmh-cpu-vdd-cdev.txt
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QTI LMH CPU Voltage cooling devices.
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The LMH CPU voltage cooling device will be used to place voltage restriction
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vote on CPU railway during cold thermal condition. This cooling device driver
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will register one cooling device per LLM, which can be used by thermal zone to
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place voltage restriction vote.
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Properties:
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- compatible:
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Usage: required
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Value type: <string>
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Definition: should be "qcom,lmh-cpu-vdd"
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Cooling device node:
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- reg:
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Usage: Required
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Value type: <a b>
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Definition: where 'a' is the starting register address of the LLM
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and 'b' is the size of LLM address space.
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- #cooling-cells:
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Usage: required
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Value type: <integer>
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Definition: Must be 2. Needed for of_thermal as cooling device
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identifier. Please refer to
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<devicetree/bindings/thermal/thermal.txt> for more
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details.
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Example:
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lmh_cpu_vdd0: qcom,lmh-cpu-vdd@18350800 {
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compatible = "qcom,lmh-cpu-vdd";
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reg = <0x18350800 0x1000>;
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#cooling-cells = <2>;
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};
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38
bindings/thermal/regulator-cdev.txt
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38
bindings/thermal/regulator-cdev.txt
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Regulator cooling device.
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The regulator cooling device, will be used to place a voltage floor
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restriction on a rail.
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Properties:
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- compatible:
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Usage: required
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Value type: <string>
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Definition: shall be "qcom,regulator-cooling-device"
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- cdev-supply:
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Usage: required
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Value type: <phandle>
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Definition: phandle to the regulator to which the cooling device will
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place a floor mitigation.
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- regulator-levels:
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Usage: required
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Value type: <U32 array>
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Definition: Array of regulator voltages the cooling device should
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use to place a floor restriction. The voltages should
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be specified in descending order.
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- #cooling-cells: Must be 2. Please refer to
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<devicetree/bindings/thermal/thermal.txt> for more
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details.
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Example:
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mv_cdev: mx-cdev-lvl {
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compatible = "qcom,regulator-cooling-device";
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cdev-supply = <®ulator-cdev-supply>;
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regulator-levels = <RPMH_REGULATOR_LEVEL_NOM
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RPMH_REGULATOR_LEVEL_OFF>;
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#cooling-cells = <2>;
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};
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55
bindings/thermal/tsens.txt
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55
bindings/thermal/tsens.txt
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Qualcomm Technologies, Inc. TSENS driver
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Temperature sensor (TSENS) driver supports reading temperature from sensors
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across the MSM. The driver defaults to support a 12 bit ADC.
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The driver uses the Thermal sysfs framework to provide thermal
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clients the ability to read from supported on-die temperature sensors,
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set temperature thresholds for cool/warm thresholds and receive notification
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on temperature threshold events.
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TSENS node
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Required properties:
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- compatible : should be "qcom,msm8996-tsens" for 8996 TSENS driver.
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should be "qcom,msm8953-tsens" for 8953 TSENS driver.
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should be "qcom,msm8998-tsens" for 8998 TSENS driver.
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should be "qcom,msmhamster-tsens" for hamster TSENS driver.
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should be "qcom,sdm660-tsens" for 660 TSENS driver.
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should be "qcom,sdm630-tsens" for 630 TSENS driver.
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should be "qcom,sdm845-tsens" for SDM845 TSENS driver.
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should be "qcom,tsens24xx" for 2.4 TSENS controller.
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should be "qcom,msm8937-tsens" for 8937 TSENS driver.
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should be "qcom,qcs405-tsens" for QCS405 TSENS driver.
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should be "qcom,sm6150-tsens" for 6150 TSENS driver.
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should be "qcom,tsens26xx" for 2.6 TSENS controller.
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The compatible property is used to identify the respective controller to use
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for the corresponding SoC.
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- reg : offset and length of the TSENS registers with associated property in reg-names
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as "tsens_srot_physical" for TSENS SROT physical address region. TSENS TM
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physical address region as "tsens_tm_physical", and "tsens_eeprom_physical" for the
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TSENS calibration fuse register region.
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- reg-names : resource names used for the physical address of the TSENS
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registers. Should be "tsens_srot_physical" for physical address of the TSENS
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SROT region, "tsens_tm_physical" for physical address of the TM region and
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"tsens_eeprom_physical" for the TSENS calibration fuse register region.
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- interrupts : TSENS interrupt to notify Upper/Lower and Critical temperature threshold.
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- interrupt-names: Should be "tsens-upper-lower" for temperature threshold.
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Add "tsens-critical" for Critical temperature threshold notification
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in addition to "tsens-upper-lower" for 8996 TSENS since
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8996 supports Upper/Lower and Critical temperature threshold.
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- tsens-reinit-wa : To support the re-initialization of tsens controller from
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trustzone
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Example:
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tsens@fc4a8000 {
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compatible = "qcom,msm-tsens";
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reg = <0xfc4a8000 0x10>,
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<0xfc4b8000 0x1ff>;
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reg-names = "tsens_srot_physical",
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"tsens_tm_physical",
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"tsens_eeprom_physical",
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interrupts = <0 184 0>;
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interrupt-names = "tsens-upper-lower";
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};
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