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Merge "dt-bindings: interconnect: add interconnect bindings"
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bindings/interconnect/qcom,lahaina.txt
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30
bindings/interconnect/qcom,lahaina.txt
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Qualcomm Technologies, Inc. Lahaina Network-On-Chip interconnect driver binding
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-----------------------------------------------------------
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Lahaina interconnect providers support system bandwidth requirements through
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RPMh hardware accelerators known as Bus Clock Manager (BCM). The provider is
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able to communicate with the BCM through the Resource State Coordinator (RSC)
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associated with each execution environment. Provider nodes must point to at
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least one RPMh device child node pertaining to their RSC and each provider
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can map to multiple RPMh resources.
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Required properties :
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- compatible : shall contain only one of the following:
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"qcom,lahaina-aggre1_noc",
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"qcom,lahaina-aggre2_noc",
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"qcom,lahaina-config_noc",
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"qcom,lahaina-dc_noc",
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"qcom,lahaina-gem_noc",
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"qcom,lahaina-lpass_ag_noc",
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"qcom,lahaina-mc_virt",
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"qcom,lahaina-mmss_noc",
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"qcom,lahaina-nsp_noc",
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"qcom,lahaina-system_noc",
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- #interconnect-cells : should contain 1
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Examples:
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aggre1_noc: interconnect@16e0000 {
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compatible = "qcom,lahaina-aggre1_noc";
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interconnect-cells = <1>;
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};
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